Thermalright LGA 177XX-BCF Black V2 Anti-Pressure Bending Bracket Pressure Plate
₨ 1,500
Protects your LGA177xx CPU and motherboard from cooler pressure damage. Enhances thermal contact and ensures even pressure across the socket.
7 Days Check Warranty
Thermalright LGA 177XX-BCF Black V2 Anti-Pressure Bending Bracket Pressure Plate
Specifications:
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Compatible Socket: Intel LGA177xx series (Next-gen platform support)
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Material: High-quality CNC-machined aluminum alloy
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Color: Matte Black finish
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Purpose: Prevents motherboard warping and CPU bending under cooler pressure
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Enhanced Design: V2 version with optimized contact pressure distribution
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Installation: Tool-free or screw-based secure mounting (hardware included)
Description:
The Thermalright LGA 177XX-BCF Black V2 is designed to eliminate the pressure-induced warping issues commonly seen on Intel’s next-generation LGA177xx socket CPUs. This anti-pressure bending bracket ensures proper and even contact between the CPU and cooler, protecting the motherboard socket from long-term strain or deformation.
Made from robust aluminum alloy, this black-finished bracket combines durability with a refined look. The V2 version features an upgraded structure to better disperse mounting pressure and increase heat transfer effectiveness—ideal for high-performance systems and overclocked rigs.
Brand
Thermalright
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