Thermalright LGA 177XX-BCF Black V2 Anti-Pressure Bending Bracket Pressure Plate

Thermalright LGA 177XX-BCF Black V2 Anti-Pressure Bending Bracket Pressure Plate

Specifications:

• Compatible Socket: Intel LGA177xx series (Next-gen platform support)

• Material: High-quality CNC-machined aluminum alloy

• Color: Matte Black finish

• Purpose: Prevents motherboard warping and CPU bending under cooler pressure

• Enhanced Design: V2 version with optimized contact pressure distribution

• Installation: Tool-free or screw-based secure mounting (hardware included)

Description:
The Thermalright LGA 177XX-BCF Black V2 is designed to eliminate the pressure-induced warping issues commonly seen on Intel’s next-generation LGA177xx socket CPUs. This anti-pressure bending bracket ensures proper and even contact between the CPU and cooler, protecting the motherboard socket from long-term strain or deformation.

Made from robust aluminum alloy, this black-finished bracket combines durability with a refined look. The V2 version features an upgraded structure to better disperse mounting pressure and increase heat transfer effectiveness—ideal for high-performance systems and overclocked rigs.